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HETERO JUNCTION FIELD EFFECT TRANSISTOR
NE3511S02
X TO Ku BAND SUPER LOW NOISE AMPLIFIER N-CHANNEL HJ-FET
FEATURES
* Super low noise figure and high associated gain NF = 0.30 dB TYP., Ga = 13.5 dB TYP. @ f = 12 GHz * Micro-X plastic (S02) package
APPLICATIONS
* X to Ku-band DBS LNB * Other X to Ku-band communication systems
ORDERING INFORMATION
Part Number NE3511S02-T1C NE3511S02-T1D Order Number NE3511S02-T1C-A NE3511S02-T1D-A Package S02 (Pb-Free) Quantity 2 kpcs/reel 10 kpcs/reel Marking B Supplying Form * 8 mm wide embossed taping * Pin 4 (Gate) faces the perforation side of the tape
Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: NE3511S02-A
ABSOLUTE MAXIMUM RATINGS (TA = +25C)
Parameter Drain to Source Voltage Gate to Source Voltage Drain Current Gate Current Total Power Dissipation Channel Temperature Storage Temperature Symbol VDS VGS ID IG Ptot
Note
Ratings 4 -3 IDSS 100 165 +125 -65 to +125
Unit V V mA
A
mW C C
Tch Tstg
Note Mounted on 1.08 cm2 x 1.0 mm (t) glass epoxy PCB
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
Document No. PG10642EJ01V0DS (1st edition) Date Published October 2006 NS CP(N)
2006
NE3511S02
RECOMMENDED OPERATING CONDITIONS (TA = +25C)
Parameter Drain to Source Voltage Drain Current Input Power Symbol VDS ID Pin MIN. 1 5 - TYP. 2 10 - MAX. 3 20 0 Unit V mA dBm
ELECTRICAL CHARACTERISTICS (TA = +25C, unless otherwise specified)
Parameter Gate to Source Leak Current Saturated Drain Current Gate to Source Cutoff Voltage Transconductance Noise Figure Associated Gain Symbol IGSO IDSS VGS (off) gm NF Ga VGS = -3 V VDS = 2 V, VGS = 0 V VDS = 2 V, ID = 100 A VDS = 2 V, ID = 10 mA VDS = 2 V, ID = 10 mA, f = 12 GHz Test Conditions MIN. - 20 -0.2 50 - 12.5 TYP. 0.5 40 -0.7 65 0.30 13.5 MAX. 10 70 -1.7 - 0.45 - Unit
A
mA V mS dB dB
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Data Sheet PG10642EJ01V0DS
NE3511S02
TYPICAL CHARACTERISTICS (TA = +25C, unless otherwise specified)
TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE
250 100 Mounted on Glass Epoxy PCB (1.08 cm2 x 1.0 mm (t) )
DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE
Total Power Dissipation Ptot (mW)
150
Drain Current ID (mA)
200
80
60 VGS = 0 V -0.2 V 20 -0.4 V -0.6 V
100
40
50
0
50
100
150
200
250
0
1.0 Drain to Source Voltage VDS (V)
2.0
Ambient Temperature TA (C)
DRAIN CURRENT vs. GATE TO SOURCE VOLTAGE
80 VDS = 2 V
Drain Current ID (mA)
60
40
20
0 -2.0
-1.0 Gate to Source Voltage VGS (V)
0
MINIMUM NOISE FIGURE, ASSOCIATED GAIN vs. FREQUENCY
2.0 25
MINIMUM NOISE FIGURE, ASSOCIATED GAIN vs. DRAIN CURRENT
1.6 16 14 Ga 12 10 8 6 NFmin 4 2 0 5 10 15 20 0 25
Minimum Noise Figure NFmin (dB)
1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 2 4 6 8 10 12 14 Frequency f (GHz) NFmin Ga
Associated Gain Ga (dB)
1.2 1.0 0.8 0.6 0.4 0.2 0.0
15
10
5 0 16 18 20
Drain Current ID (mA)
Remark The graphs indicate nominal characteristics.
Data Sheet PG10642EJ01V0DS
3
Associated Gain Ga (dB)
20
Minimum Noise Figure NFmin (dB)
VDS = 2 V ID = 10 mA
f = 12 GHz 1.4 VDS = 2 V
NE3511S02
S-PARAMETERS
S-parameters/Noise parameters are provided on our web site in a form (S2P) that enables direct import to a microwave circuit simulator without keyboard input. Click here to download S-parameters. [RF and Microwave] [Device Parameters] URL http://www.ncsd.necel.com/microwave/index.html
4
Data Sheet PG10642EJ01V0DS
NE3511S02
RF MEASURING LAYOUT PATTERN (REFERENCE ONLY) (UNIT: mm)
2.80 2.60 2.06 0.64
1.7 mm/R.P.
2.06
0.74
0.54
2.6 Reference Plane (Calibration Plane) 1.7 1.7 Reference Plane (Calibration Plane)
0.3 TH
L2-uX Ver. 1
6.0
RT/duroid 5880/ROGERS t = 0.254 mm r = 2.20 tan delta = 0.0009 @10 GHz
13.0
Data Sheet PG10642EJ01V0DS
5
NE3511S02
PACKAGE DIMENSIONS S02 (UNIT: mm)
(Top View)
3.20.2 0.65 TYP. 1 2.20.2 1
(Bottom View)
0.5 TYP.
2.60.1
B
2 4 3
2.20.2
4
2
3
(Side View)
2.20.2 1.7
1.5 MAX.
0.150.05
3.20.2
PIN CONNECTIONS
1. 2. 3. 4. Source Drain Source Gate
6
Data Sheet PG10642EJ01V0DS
NE3511S02
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220C or higher Preheating time at 120 to 180C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260C or below : 10 seconds or less : 60 seconds or less : 12030 seconds : 3 times : 0.2%(Wt.) or below : 350C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 Condition Symbol IR260
For soldering
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10642EJ01V0DS
7
NE3511S02
* The information in this document is current as of October, 2006. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. * NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. * NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above).
M8E 02. 11-1
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Data Sheet PG10642EJ01V0DS
NE3511S02
Caution
GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. * Do not lick the product or in any way allow it to enter the mouth.
For further information, please contact NEC Compound Semiconductor Devices Hong Kong Limited E-mail: contact@ncsd-hk.necel.com Hong Kong Head Office TEL: +852-3107-7303 FAX: +852-3107-7309 Taipei Branch Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Korea Branch Office TEL: +82-2-558-2120 FAX: +82-2-558-5209 NEC Electronics (Europe) GmbH http://www.eu.necel.com/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 Compound Semiconductor Devices Division NEC Electronics Corporation URL: http://www.ncsd.necel.com/
0604
4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279
Subject: Compliance with EU Directives
CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix -A indicates that the device is Pb-free. The -AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL's understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information.
Restricted Substance per RoHS Lead (Pb) Mercury Cadmium Hexavalent Chromium PBB PBDE Concentration Limit per RoHS (values are not yet fixed) < 1000 PPM < 1000 PPM < 100 PPM < 1000 PPM < 1000 PPM < 1000 PPM Concentration contained in CEL devices -A Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected -AZ (*)
If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative.
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